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    6000 FSA光刻機

    應用于半導體行業(yè):

    半導體加工設備-光刻設備-UV光刻機

    產(chǎn)品品牌

    OAI

    庫       存:

    10000

    產(chǎn)       地:

    全國

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    品牌:OAI

    型號:

    所屬系列:半導體加工設備-光刻設備-UV光刻機

    型號6000 FSA用于生產(chǎn)的全自動(dòng),上側或后側光刻機

     

    用于:半導體,MEMS,傳感器,微流體,IOT,包裝

    憑借在半導體行業(yè)40多年的制造,OAI滿(mǎn)足了一個(gè)新的精英階段的生產(chǎn)光刻設備的動(dòng)態(tài)市場(chǎng)的日益增長(cháng)的挑戰。

    建立在著(zhù)名的OAI模塊化平臺上,6000系列具有完全自動(dòng)化的亞微米分辨率的頂側或背側對齊,提供無(wú)與倫比的性?xún)r(jià)比。

    對準器具有先進(jìn)的光束光學(xué),在第一掩模模式下具有優(yōu)于±3%的均勻性和每小時(shí)180個(gè)晶片的吞吐量,這導致更高的產(chǎn)量。 6000系列可以處理厚和粘合基板(高達7000微米),翹曲晶片(高達7 mm-10mm),薄基板(低至100微米厚)和厚光致抗蝕劑的各種晶片。

    具有卓越的工藝重復性,6000系列是所有生產(chǎn)環(huán)境的完美解決方案。選擇頂部或可選的背面對齊,使用OAI的基于Cognex的自定義模式識別軟件。對于總體光刻工藝,Series1 6000可以與集束工具無(wú)縫集成。 OAI的新生產(chǎn)面罩對齊器是總包。

    好處

    ·全自動(dòng)

    ·側面對齊

    •可選:底部對齊

    UV到NUV

    ·集群工具集成

    ·自定義軟件

    規格

     

    曝光系統

    曝光模式真空接觸硬接觸軟接觸接近(2μ間隙)

    高級光束

    均勻梁尺寸:50mm - 200mm方形/圓

    200mm-300mm見(jiàn)方/圓

    均勻度:優(yōu)于±3%

    相機:雙攝像頭與CCTV擴展的景深

    對齊系統

    模式識別CognexvisionPro¹™與OAI定制軟件

    對準精度0.5μ頂面

    1.0μ,頂部到底部可選背面對齊

    預對準精度優(yōu)于±50μ

    自動(dòng)對齊頂部到底部

    頂部

    晶片處理

    基材尺寸50mm-200mm圓形或方形或200mm-300mm圓形或正方形

    薄晶片低至100M

    翹曲晶片高達7mm-10mm

    厚和粘合基板高達7000μ

    機器人單臂和雙臂晶片處理

    失步補償標準軟件或可選的熱卡盤(pán)

    晶片尺寸轉換5分鐘以?xún)?/p>

    吞吐量第一掩模每小時(shí)180個(gè)晶片 - 隨后75-100個(gè)晶片每小時(shí)

    楔形效果平整3點(diǎn)或可選非接觸

    可用選項

    IR自動(dòng)對齊,

    盒式磁帶映射

    365nm LED曝光光源

    溫度控制晶片卡盤(pán)

    集成屏蔽管理控制

    用于全光刻的集成光刻集群

    使用SMIF或FOUP接口模塊的過(guò)程環(huán)境控制

    非接觸式調平

    邊緣夾緊

     Model 6000 FSA Fully Automated, Topside or Backside Mask Aligner for Production

    光刻機Model6000FSA Mask Aligner

    For: Semiconductors, MEMS, Sensors, Microfluidics, IOT, Packaging

    With over 4 decades of manufacturing in the semiconductor industry, OAI meets the growing challenge of a dynamic market with a new elite class of production photolithography equipment.

    Built on the venerable OAI modular platform, the Series 6000 has topside or backside alignment that is fully automated with sub-micron resolution which delivers performance that is unmatched at any price.

    The Aligners have Advanced Beam Optics with better than ±3% uniformity and a throughput of 180 wafers per hour in first mask mode, which results in higher yields. The Series 6000 can handle a wide variety of wafers from thick and bonded substrates (up to 7000 microns), warped wafers (up to 7 mm-10mm), thin substrates (down to 100 micron thick), and thick photo resist.

    With superb process repeatability, the Series 6000 is the perfect solution for all production enviroments. Choose either top side or optional back side alignment which uses OAI's customized pattern recognition software that is Cognex based. For the total lithography process, the Seriesl 6000 can be integrated seamlessly with cluster tools. OAI's new production mask Aligners are the total package.

    BENEFITS

    · Fully Automated

    · Topside Alignment

    · Optional: Bottomside Alignment

    · DUV to NUV

    · Cluster Tool Integration

    · Customized Software

    SPECIFICATIONS

     

     

    Exposure System

    Exposure Modes

    Vacuum contact

    Hard contact

    Soft contact

    Proximity (2μ gap)

     

    Advanced Beam Optics

    Uniform Beam Size:

    50mm - 200mm square/round

     

    200mm - 300 mm square/round

    Uniformity:

    Better than ±3%

    Camera:

    Dual Camera with CCTV with Expanded Depth of Field

    Alignment System

    Pattern Recognition

    Cognex visionPro¹™ with OAI customized software

    Alignment Accuracy

    0.5μ topside

     

    1.0μ with top to bottom optional backside alignment

    Pre-alignment Accuracy

    Better than ±50μ

    Auto-alignment

    Top to bottomside

     

    Topside

    Wafer Handling

    Substrate size

    50mm – 200mm round or square or 200mm-300mm round or square

     

    Thin wafers

    Down to 100Μ

     

    Warped Wafers

    Up to 7mm-10mm

     

    Thick & Bonded Substrates

    Up to 7000μ

     

    Robotics

    Single and dual arm wafer handling

     

    Run-out compensation

    Standard software or optional thermal chuck

     

    Wafer size conversion

    5 minutes or less

     

    Throughput

    1st mask 180 wafers per hour - subsequent 75-100 wafers per hour

     

    Wedge Effect Leveling

    3 point or optional non-contact

     

    Available Options

     

    IR Auto-align,

     

     

    Cassette Mapping

     

     

    365nm LED Exposure Light Source

     

     

    Temperature Controlled Wafer Chuck

     

     

    Integrated Mask Management Control

     

     

    Integrated Lithography Cluster for Full Lithography

     

     

    Process Environment Control with SMIF or FOUP Interface Modules

     

     

    Non-contact Leveling

     

     

    Edge Gripping

     

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